Electronic Grade Glass Fibre for PCB Substrates
topic
Electronic or E-CR glass fibre for printed circuit board substrates requires ultra-low alkali content below 0.2 percent to minimise electrical conductivity, precisely controlled filament diameter at 5 to 7 micrometres, and uniformly woven 7628 and 2116 fabric constructions impregnated with flame-retardant epoxy resin to produce FR4 laminate with dielectric constant of 4.5 and loss tangent of 0.02 at 1 megahertz.
Role
Provides the structural and dielectric substrate material that enables the multilayer printed circuit board technology underpinning all modern electronic devices, where glass fibre fabric weave construction, resin system selection, and dimensional stability during thermal cycling determine PCB reliability and signal integrity performance in consumer electronics and telecommunications infrastructure.